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Tutorials Tutorials

This page lists all the assembly and use tutorials available for all of our products. You will need Acrobat Reader to read the files downloadable from this page.

The 430 SMD to DIP Adapter Tutorials

The table below has links to the detailed tutorial files for assembling the 430 SMD to DIP Adapter products. The (US) indicates that the file prints out at the standard U.S. Letter size 8.5" x 11" [21.6cm x 27.9cm]. The (A4) indicates that the file prints out at the A4 paper size 8.3" x 11.7" [21.0cm x 29.7cm]. The number in parenthesis is the file size.

430-20D (US)
(404Kb)
430-28D (US)
(404Kb)
430-64Q (US)
(498Kb)
430-80Q (US)
(498Kb)
430-100Q (US)
(498Kb)
430-JTAG(US)
(189Kb)
430-20D (A4)
(404Kb)
430-28D (A4)
(404Kb)
430-64Q (A4)
(498Kb)
430-80Q (A4)
(498Kb)
430-100Q (A4)
(498Kb)
430-JTAG (A4)
(189Kb)

Important Information for Non-MSP430 Part Mounting

In the 430-Q-US.pdf and 430-Q-A4.pdf tutorials (for the 430-64Q, 430-80Q and 430-100Q SMD to DIP Adapters), some steps will need to be slightly changed and one will probably not apply when adapting a non-MSP430 part. Below are the tutorial changes needed when mounting non-MPS430 parts on the 430 series of Quad Flat Pack (QFP) SMD to DIP Adapters:

  • In step 1 on page 3, "Part and Adapter Familiarization", a non-MSP430 part's pin 1 may be marked differently. Check the part's data sheet to learn how to locate pin 1.
  • In step 2 on page 4, "Tinning the Solder Iron", the soldering iron temperature is set to 600 degrees Fahrenheit [315 degrees Celsius]. A non-MSP430 part could be damaged with an iron at this temperature, check the part's data sheet for its proper soldering temperature.
  • In step 3 on page 4, "Inspection of MSP430 Part", there probably isn't a Clamshell socket available to straighten bent pins.
  • In step 8 on page 6, "Testing for Solder Bridges", there probably won't be internally connected pins as mentioned in the text. On some analog-digital hybrid parts where there are separate analog and digital powers and grounds, those powers and grounds may be internally connected. Check with the part's data sheet or test them for continuity before mounting the part. If a person that is mounting the part is unaware of any internally connected pins, then it could create a false impression of a solder bridge that doesn't exist.
  • In step 10 on page 7, "Attaching Decoupling Capacitors", These are specifically for the Texas Instruments MSP430 series. Non-MSP430 parts probably won't make use of them.
In the 430-D-US.pdf and 430-D-A4.pdf tutorials (for the 430-20D and 430-28D SMD to DIP Adapters), some steps will need to be slightly changed when adapting a non-MSP430 part. Below are the tutorial changes needed when mounting non-MSP430 parts on the 430 series of Small Outline Wide Body (SOWB) SMD to DIP Adapters:

  • In step 1 on page 3, "Part and Adapter Familiarization", a non-MSP430 part's pin 1 may be marked differently. Check the part's data sheet to learn how to locate pin 1.
  • In step 2 on page 4, "Tinning the Solder Iron", the soldering iron temperature is set to 600 degrees Fahrenheit [315 degrees Celsius]. A non-MSP430 part could be damaged with an iron at this temperature, check the part's data sheet for its proper soldering temperature.
  • In step 3 on page 4, "Inspection of MSP430 Part", there probably isn't a ZIF socket available to straighten bent pins.
  • In step 8 on page 6, "Testing for Solder Bridges", on some analog-digital hybrid parts where there are separate analog and digital powers and grounds, those powers and grounds may be internally connected. Check with the part's data sheet or test them for continuity before mounting the part. If a person that is mounting the part is unaware of any internally connected pins, then it could create a false impression of a solder bridge that doesn't exist.

 
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