The 430-64Q Quad Flat Package (QFP) SMD to DIP Adapter kit adapts a 64 pin Quad Flat Package (QFP) Surface Mount Device (SMD) [JEDEC MS-026] to a 64 pin Dual Inline Package (DIP) package which makes the SMD device suitable for solderless breadboarding and wire-wrap prototyping.

Underneath the power and analog input pins is a ground plane to help reduce signal noise. It also has two sets of 1206 SMD lands on the top of the Adapter board for use by decoupling capacitors. The ground plane and decoupling capacitors are only useful for MSP430 parts.

The kit contains:

• one 430-64Q Adapter board
• two 32 pin Single Inline Pin (SIP) connectors {0.025" [0.635mm] square pins and 0.100" [2.54mm] pin spacing}

The 430-64Q Adapter board dimensions are (refer to the figure below):

Height -- Item A: 0.804" [20.42mm]

Width -- Item B: 3.207" [81.46mm]

Center to Center Hole Spacing -- Item C: 0.100" [2.54mm]

Center to Center Connector Spacing -- Item D: 0.700" [17.78mm]

Adapter Board Thickness -- 0.062" [1.57mm]

Usable Pin Length of SIPs -- 0.239" [6.07mm]

The Texas Instruments MSP430 tools associated with the 430-64Q Adapter are:

MSP-FET430P140 Flash Emulation Tool (FET)

MSP-PRGS430 Serial Programmer

The following MSP430 parts are supported by the 430-64Q Adapter:

For use with non-TI parts here is a footprint drawing.

Texas Instruments offers FREE MSP430 samples for your prototyping needs. They can be ordered from the part links above.

It is recommended that a 430-JTAG Adapter Kit be used in conjunction with the 430-64Q Adapter Kit, so we offer a special bundle price for this part and the 430-JTAG Adapter Kit.

A printable mounting and assembly tutorial in US Letter or A4 paper size format is available. You will need Acrobat Reader to read this.