The 430-28D Small Outline Wide Body (SOWB) SMD to DIP Adapter kit adapts a 28 pin Small-Outline Wide Body (SOWB) Surface Mount Device (SMD) [JEDEC MS-013] to a 28 pin Dual Inline Package (DIP) package which makes the SMD device suitable for solderless breadboarding and wire-wrap prototyping.

The kit contains:

• one 430-28D Adapter board
• two 14 pin Single Inline Pin (SIP) connectors {0.025" [0.635mm] square pins and 0.100" [2.54mm] pin spacing}

The 430-28D Adapter board dimensions are (refer to the figure below):

Height -- Item A: 0.606" [15.39mm]

Width -- Item B: 1.407" [35.74mm]

Center to Center Hole Spacing -- Item C: 0.100" [2.54mm]

Center to Center Connector Spacing -- Item D: 0.500"

Adapter Board Thickness -- 0.062" [1.57mm]

Usable Pin Length of SIPs -- 0.239" [6.07mm] [12.70mm]

The Texas Instruments MSP430 tools associated with the 430-28D Adapter are:

MSP-FET430P120 Flash Emulation Tool (FET)

MSP-PRGS430 Serial Programmer

The following MSP430 parts are supported by the 430-28D Adapter:

MSP430F122IDW

MSP430F1222IDW

MSP430F123IDW

MSP430F1232IDW

For use with non-TI parts here is a footprint drawing.

Texas Instruments offers FREE MSP430 samples for your prototyping needs. They can be ordered from the part links above.

It is recommended that a 430-JTAG Adapter Kit be used in conjunction with the 430-28D Adapter Kit, so we offer a special bundle price for this part and the 430-JTAG Adapter Kit.

A printable mounting and assembly tutorial in US Letter or A4 paper size format is available. You will need Acrobat Reader to read this.